OPTICAL SURFACE PROFILOMETRY

The OSP-300 system design is based on an optical interaction between a light source and semiconductor wafers as a non-destructive wafer-surface profile characterization and process monitoring tool for R&D and manufacturing applications. The system provides new insights into wafer characteristics and process effects, with a minimum cost of ownership.

Applications

Nondestructive Wafer Characterization and In-Line Process Monitoring
Wafer Flatness
Wafer Curvature
Height Contour Maps
Vector Plots
Distortion Histogram, etc.

Key Benefits & Specifications

Simple and Robust Design
Excellent Sensitivity to
– Surface Flatness
– Local Distortion
– Global Warpage
– Pattern Rotation
– Twist and Distortion
Important In-Line Process Monitoring Information
– Wafer Flatness
– Wafer Curvature
– Height Contour Maps
– Vector Plots
– Distortion Histogram, etc.
Nondestructive Optical Characterization
No Sample Preparation
Can Sample All Wafers
– Blanket
– Processed
– Patterned
– Device Wafers
Fast Start up (same day)
Minimum Consumables
Minimal Facility Requirement:
– Electricity: 3phase 220VAC 10kVA
– CDA: 0.55 MPa
– Vacuum: -60kPa
Small Footprint
Built-in Two FOUP Openers